Applications
From printed circuit boards to heritage objects, our digital X-ray capability supports a wide range of safe, stable items requiring non-destructive examination.
Digital X-ray inspection for PCBs, PCB assemblies, BGA and QFN solder joints, potted electronics, power supplies, control modules and hidden internal defects.
Non-destructive X-ray imaging can help identify differences in internal component construction, die layout, bond wires and assembly features.
Understand what has happened inside a returned or failed product before dismantling it, refunding it, rejecting a claim or escalating the issue.
X-ray inspection may support investigation of battery-powered products and assemblies where the item is safe and lawful to handle. Damaged, swollen, leaking, overheating or otherwise unstable batteries must not be posted and may require a pre-assessment or attended route.
Support product design and development by seeing internal construction without cutting, opening or destroying prototypes.
Inspection of small castings, machined parts, additive-manufactured components, valves, pumps and enclosed assemblies.
Digital X-ray imaging and written reports for safe items involved in legal, insurance, claim, fraud, product liability or technical dispute cases.
Non-invasive X-ray imaging for selected small heritage objects, ceramics, panels, artefacts and valuable items where internal construction or previous repair may be relevant.